Xeon

Intel Xeon E3-1276V3. Processor family: Intel® Xeon® E3 V3 Family, Processor socket: LGA 1150 (Socket H3), Processor lithography: 22 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 32 GB, Memory types supported by processor: DDR3-SDRAM, DDR3L-SDRAM. On-board graphics card model: Intel® HD Graphics P4600, Maximum on-board graphics card memory: 1.7 GB, On-board graphics card outputs supported: Embedded DisplayPort (eDP), DisplayPort, HDMI, VGA (D-Sub). Market segment: Server, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 4 GHz

Intel Xeon E3-1275V5. Processor family: Intel® Xeon® E3 v5, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 64 GB, Memory types supported by processor: DDR4-SDRAM, DDR3L-SDRAM. On-board graphics card model: Intel® HD Graphics P530, Maximum on-board graphics card memory: 64 GB, On-board graphics card outputs supported: Embedded DisplayPort (eDP), DisplayPort, HDMI, DVI. Market segment: Server, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 4 GHz

Lenovo 4XG7A37933. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX-512, Scalability: 2S. Processor package size: 76 x 56.5 mm. Compatibility: ThinkSystem SR530, ThinkSystem SR570, ThinkSystem SR630

Intel Xeon E-2146G. Processor family: Intel Xeon E, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. On-board graphics card model: Intel UHD Graphics P630, Maximum on-board graphics card memory: 128 GB, On-board graphics card outputs supported: Embedded DisplayPort (eDP),DisplayPort,HDMI,DVI. Market segment: Server, PCI Express configurations: 1x16,2x8,1x8+2x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 4.5 GHz

Intel Xeon ® ® E-2356G Processor (12M Cache, 3.20 GHz). Processor family: Intel Xeon E, Processor socket: LGA 1200 (Socket H5), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. On-board graphics card model: Intel UHD Graphics P750, Maximum on-board graphics card memory: 64 GB, On-board graphics card base frequency: 350 MHz. Market segment: Server, PCI Express configurations: 1x16+1x4,2x8+1x4,1x8+3x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0,AVX-512. Intel® Turbo Boost Technology 2.0 frequency: 5 GHz, Maximum Enclave Size Support for Intel® SGX: 0.5 GB

Intel Xeon E-2246G. Processor family: Intel Xeon E, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. On-board graphics card model: Intel UHD Graphics P630, Maximum on-board graphics card memory: 128 GB, On-board graphics card base frequency: 350 MHz. Market segment: Server, PCI Express configurations: 1x16,2x8,1x8+2x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 4.8 GHz

Lenovo Xeon Intel Silver 4309Y. Processor family: Intel Xeon Silver, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6144 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 8 GB. Package type: Retail box

Lenovo Xeon Silver 4310. Processor family: Intel Xeon Silver, Processor socket: LGA 4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6144 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, AVX 2.0, AVX-512, SSE4.2, Scalability: 2S. Processor package size: 77.5 x 56.5 mm. Compatibility: Lenovo ThinkAgile HX5530, Lenovo ThinkAgile HX5531, Lenovo ThinkAgile HX7530, Lenovo ThinkAgile...

Lenovo Xeon Intel Silver 4309Y Option Kit w/o Fan. Processor family: Intel Xeon Silver, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6144 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 8 GB. Package type: Retail box

Intel Xeon E-2336. Processor family: Intel Xeon E, Processor socket: LGA 1200 (Socket H5), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Use conditions: Server/Enterprise, PCI Express configurations: 1x16+1x4,2x8+1x4,1x8+3x4. Intel® Turbo Boost Technology 2.0 frequency: 4.8 GHz, Maximum Enclave Size Support for Intel® SGX: 0.5 GB. Package type: Retail box

Intel Xeon E-2136. Processor family: Intel® Xeon®, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 4.5 GHz. Package type: Retail box

Intel Xeon W-2223. Processor family: Intel Xeon W, Processor socket: LGA 2066 (Socket R4), Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1024 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Workstation, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512, Scalability: 1S. Package width: 1.73" (44 mm), Package depth: 4.57" (116 mm), Package height: 3.98" (101 mm). Processor package size: 45mm x 52.5mm

Lenovo Intel Xeon E5-2630 v4. Processor family: Intel® Xeon® E5 v4, Processor socket: LGA 2011-v3, Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1.54 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX 2.0, Scalability: 2S. Compatibility: HPE DL180 Gen9

Intel Xeon ® ® E-2336 Processor (12M Cache, 2.90 GHz). Processor family: Intel Xeon E, Processor socket: LGA 1200 (Socket H5), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16+1x4,2x8+1x4,1x8+3x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0,AVX-512. Intel® Turbo Boost Technology 2.0 frequency: 4.8 GHz, Maximum Enclave Size Support for Intel® SGX: 0.5 GB. Package type: Retail box

Intel Xeon E-2136. Processor family: Intel® Xeon®, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16,2x8,1x8+2x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 4.5 GHz. Package width: 2.76" (70 mm), Package depth: 4.57" (116 mm), Package height: 3.98" (101 mm)

Intel Xeon E-2236. Processor family: Intel Xeon E, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16,2x8,1x8+2x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 4.8 GHz. Package width: 2.76" (70 mm), Package depth: 4.57" (116 mm), Package height: 3.98" (101 mm)

Intel Xeon E5-2609V4. Processor family: Intel® Xeon® E5 v4, Processor socket: LGA 2011-v3, Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1.54 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX 2.0, Scalability: 2S. Package width: 1.73" (44 mm), Package depth: 5.51" (140 mm), Package height: 4.61" (117 mm). Processor package size: 45mm x 52.5mm

Lenovo Intel Xeon Silver 4210T. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1.02 TB, Memory types supported by processor: DDR4-SDRAM. Supported instruction sets: AVX 2.0, AVX-512, SSE4.2, AVX, Scalability: 2S