Houston, TX Office Equipment - Apollo Office Systems
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Digi 76000956 development board

6182245
Digi 76000956

Digi RCM3000 development board 30 MHz

4942141
Digi RCM3000. Processor frequency: 30 MHz. Board dimensions: 1.85 x 2.72" (47 x 69 mm)

Digi XK3-C-A2-UT-U development board

5427668
Digi XK3-C-A2-UT-U. Input voltage (max): 3.3 - 4.3 V. Board dimensions: 0.96 x 1.3" (24.4 x 32.9 mm)

Digi XK3-C-N1-UT-E development board

5427675
Digi XK3-C-N1-UT-E. Input voltage (max): 3.3 - 4.3 V, Peak current: 550 mA. Board dimensions: 0.96 x 1.3" (24.4 x 32.9 mm)

Digi XK3-C-A1-UT-U development board

5427670
Digi XK3-C-A1-UT-U. Input voltage (max): 3 - 5.5 V, Peak current: 1000 mA. Board dimensions: 0.96 x 1.3" (24.4 x 32.9 mm)

Intel RealSense Robotic Development Kit development board 1.44 MHz Intel Atom®

4902101
Intel RealSense Robotic Development Kit. Processor frequency: 1.44 MHz, Processor model: Intel Atom®, Processor socket: BGA 592. Maximum internal memory: 4 GB, Internal memory type: DDR3L, Memory clock speed: 1600 MHz. USB version: 2.0/3.2 Gen 1 (3.1 Gen 1), HDMI version: 1.4b. Board type: Compute module. On-board graphics adapter model: Intel® HD Graphics 400

Intel ® NUC Board Element CMB1BB

5854502
Intel ® NUC Board Element CMB1BB. Thermal Design Power (TDP): 15 W. SSD form factor: M.2. Form factor: U-series Element Carrier Board. DC input voltage: 12~24 V. Additional headers: Front panel (PWR_SW, PWR_LED, RST, HDD_Act, 5V); Internal 2x2 power connector, Export Control Classification Number (ECCN): EAR99

Intel ® NUC Rugged Board Element CMB1ABA

5747423
Intel ® NUC Rugged Board Element CMB1ABA. Thermal Design Power (TDP): 15 W. SSD form factor: M.2. Form factor: U-series Element Carrier Board. DC input voltage: 12~24 V. Additional headers: Front panel (PWR_SW, PWR_LED, RST, HDD_Act, 5V, 5Vsby, 3.3Vsby); Internal 2x2 power connector, Export Control Classification Number (ECCN): EAR99

Intel ® NUC Rugged Board Element CMB1ABB

5747425
Intel ® NUC Rugged Board Element CMB1ABB. Thermal Design Power (TDP): 15 W. SSD form factor: M.2. Form factor: U-series Element Carrier Board. DC input voltage: 12~24 V. Additional headers: Front panel (PWR_SW, PWR_LED, RST, HDD_Act, 5V, 5Vsby, 3.3Vsby); Internal 2x2 power connector, Export Control Classification Number (ECCN): EAR99

Intel ® NUC Assembly Element CMA1BB

5854501
Intel ® NUC Assembly Element CMA1BB. Thermal Design Power (TDP): 15 W. SSD form factor: M.2. Form factor: U-series Element Carrier Board. DC input voltage: 12~24 V. Additional headers: Front panel (PWR_SW, PWR_LED, RST, HDD_Act, 5V); Internal 2x2 power connector, Export Control Classification Number (ECCN): EAR99

Digi ConnectCore 6UL SBC Pro 1G-1G-W-BT development board 528 MHz

5851506
Digi ConnectCore 6UL SBC Pro 1G-1G-W-BT. Processor frequency: 528 MHz. Maximum internal memory: 4 GB. Board dimensions: 3.94 x 2.83" (100 x 72 mm)

Digi BL2120 development board 22.1 MHz

5940955
Digi BL2120. Processor frequency: 22.1 MHz. Board dimensions: 2.99 x 2.6" (76 x 66 mm)