Processors

Intel Core i9-13900KF. Processor family: Intel® Core™ i9, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM, DDR5-SDRAM. Market segment: Desktop, Use conditions: PC/Client/Tablet, PCI Express slots version: 5.0, 4.0. Intel® Turbo Boost Max Technology 3.0 frequency: 5.7 GHz, Intel® Thermal Velocity Boost Frequency: 5.8 GHz. Package type: Retail box

Cisco Intel Xeon E5-2630 v2. Processor family: Intel® Xeon® E5 V2 Family, Processor socket: LGA 2011 (Socket R), Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, PCI Express configurations: 1x4, 1x8, 1x16, Supported instruction sets: AVX. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x

Cisco Intel Xeon E5-2630 v2. Processor family: Intel® Xeon® E5 V2 Family, Processor socket: LGA 2011 (Socket R), Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S

AMD Opteron Dual-Core 8218. Processor family: AMD Opteron, Processor socket: Socket F (1207), Processor lithography: 90 nm. L1 cache: 0.125 MB

Lenovo Intel Xeon Gold 5218. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX-512, Scalability: 4S. Compatibility: ThinkSystem ST550

AMD Opteron Dual-Core 8218. Processor family: AMD Opteron, Processor socket: Socket F (1207), Processor lithography: 90 nm. L1 cache: 0.125 MB

AMD Opteron 2224 SE 3.2GHz. Processor family: AMD Opteron, Processor socket: Socket F (1207), Processor lithography: 90 nm

Lenovo Intel Xeon E5-2670 v2. Processor family: Intel® Xeon® E5 V2 Family, Processor socket: LGA 2011 (Socket R), Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, PCI Express configurations: 1x4, 1x8, 1x16, Scalability: 2S. Width: 1.77" (45 mm), Depth: 2.07" (52.5 mm), Height: 0.18" (4.56 mm). Intel® Virtualization Technology (Intel® VT): VT-d, VT-x

Lenovo Intel Xeon Gold 5222. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX-512, Scalability: 4S. Compatibility: ThinkSystem SR530/SR570

Lenovo Intel Xeon Gold 5222. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX-512, Scalability: 4S. Compatibility: ThinkSystem SR630

AMD Opteron Dual Core Model 8218. Processor family: AMD Opteron, Processor socket: Socket F (1207), Processor lithography: 90 nm

Lenovo Intel Xeon Gold 5218. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX-512, Scalability: 4S. Compatibility: ThinkSystem SR550/SR590/SR650

Intel E7310. Processor family: Intel® Xeon® E7 Family, Processor socket: Socket 604 (mPGA604), Processor lithography: 65 nm. Market segment: Server, Number of Processing Die Transistors: 582 M, Processing Die size: 286 mm². Package width: 1.73" (44 mm), Package depth: 5.51" (140 mm), Package height: 4.61" (117 mm). Processor package size: 53.3mm x 53.3mm. Intel® Virtualization Technology (Intel® VT): VT-x, Cache memory: 4 MB

Cisco Intel Xeon E5-2630 v3. Processor family: Intel Xeon E5 v3, Processor socket: LGA 2011-v3, Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S. Processor package size: 52.5 mm

Cisco E5-2630V3. Processor family: Intel Xeon E5 v3, Processor socket: LGA 2011-v3, Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 1x4, 1x8, Supported instruction sets: AVX. Processor package size: 52.5 mm

Intel Core ® ™ i7-12700K Processor (25M Cache, up to 5.00 GHz). Processor family: Intel® Core™ i7, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM,DDR5-SDRAM. On-board graphics card model: Intel UHD Graphics 770, On-board graphics card outputs supported: Embedded DisplayPort (eDP) 1.4b,DisplayPort 1.4a,HDMI 2.1, On-board graphics card base frequency: 300 MHz. Market segment: Desktop, Use conditions: PC/Client/Tablet, Workstation, PCI Express configurations: 1x16+1x4,2x8+1x4. Intel® Turbo Boost Max Technology 3.0 frequency: 5 GHz

AMD EPYC 7443P. Processor family: AMD EPYC, Processor socket: Socket SP3, Processor manufacturer: AMD. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM, Memory clock speeds supported by processor: 3200 MHz. Market segment: Server

AMD Opteron 6378. Processor family: AMD Opteron, Processor socket: Socket G34, Processor lithography: 32 nm. Memory types supported by processor: DDR3-SDRAM, Memory clock speeds supported by processor: 1333,1600 MHz. Market segment: Server, Processing Die size: 315 mm². L1 cache: 0.768 MB, Temperature (max): 69 °C