Houston, TX Office Equipment - Apollo Office Systems

StarTech.com SILVGREASE1 heat sink compound 1.93 W/m·K 0.353 oz (10 g)

StarTech.com SILVGREASE1. Thermal conductivity: 1.93 W/m·K, Product color: Silver, Thermal resistance: 0.12 °C/W. Depth: 2.64" (67 mm), Weight: 0.353 oz (10 g). Package width: 3.31" (84 mm), Package depth: 5.94" (151 mm), Package height: 0.984" (25 mm)
Manufacturer: StarTech.com
SKU: 495875
Manufacturer part number: SILVGREASE1
GTIN: 0065030788847
Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink. A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage. Please see our support section for the Material Safety Data Sheet for SILVGREASE1.
The StarTech.com Advantage - Better thermal conductivity over standard silicon-based compounds and negligible electrical conductivity for effective and safe use in high performance applications
Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink. A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage. Please see our support section for the Material Safety Data Sheet for SILVGREASE1.
The StarTech.com Advantage - Better thermal conductivity over standard silicon-based compounds and negligible electrical conductivity for effective and safe use in high performance applications
Products specifications
Attribute nameAttribute value
Package width3.31"
Package depth5.94"
Package weight0.6 oz
Operating temperature (T-T)-30 - 180 °C
Thermal resistance0.12 °C/W
Thermal conductivity1.93 W/m·K
Specific gravity1.7 g/cm³
Evaporation (@ 200°C/24h)0.001 %
Bleed (@ 200°C/24h)0.05 %