Lenovo Intel Xeon Gold 6130 processor 2.1 GHz 22 MB L3

Lenovo Intel Xeon Gold 6130. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, AVX 2.0, AVX-512, SSE4.2, Scalability: S4S. Processor package size: 76 x 56.5 mm
Manufacturer: Lenovo
SKU: 5076615
Manufacturer part number: 4XG7A07221
GTIN: 0889488458592
For the SR570 server models that come standard with one processor, the second processor can be ordered, if required. The second processor must be of the same model as the first processor. The second processor option includes a processor, a heatsink, and two additional single-rotor system fans.
For the SR570 server models that come standard with one processor, the second processor can be ordered, if required. The second processor must be of the same model as the first processor. The second processor option includes a processor, a heatsink, and two additional single-rotor system fans.
Products specifications
Attribute nameAttribute value
Memory clock speeds supported by processor2666 MHz
Tcase87 °C
Processor generation1st Generation Intel® Xeon® Scalable
Processor base frequency2.1 GHz
On-board graphics cardNo
Supported instruction setsAVX, AVX 2.0, AVX-512, SSE4.2
Intel® vPro™ Platform EligibilityYes
Intel® Optane™ Memory ReadyNo
Cooler includedYes
Market segmentServer
Intel Turbo Boost Max Technology 3.0No
Intel® Speed Shift TechnologyYes
Features
Component forServer/workstation
Memory channelsHexa-channel
ECCYes
Processor
Processor familyIntel® Xeon® Gold
Processor model6130
Processor boost frequency3.7 GHz
Processor cores16
Processor threads32
Processor cache22 MB
PCI Express slots version3.0
Processor cache typeL3
Processor lithography14 nm
Processor operating modes64-bit
Processor package size76 x 56.5 mm
Processor socketLGA 3647 (Socket P)
ScalabilityS4S
Thermal Design Power (TDP)125 W
Maximum internal memory supported by processor768 GB
Conflict-Free processorYes
Processor special features
Intel® Turbo Boost Technology2.0
Maximum number of PCI Express lanes48
Memory types supported by processorDDR4-SDRAM
Embedded options availableYes
Intel 64Yes
Intel Trusted Execution TechnologyYes
Intel TSX-NIYes
Intel Virtualization Technology (VT-x)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Product tags
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