On-board graphics card | N |
Discrete graphics card model | Not available |
Supported instruction sets | AVX-512 |
Memory clock speeds supported by processor | 2667 MHz |
Tcase | 79 °C |
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 3 GHz |
Intel® vPro™ Platform Eligibility | Y |
Discrete graphics card | N |
Harmonized System (HS) code | 85423119 |
Market segment | Server |
Intel Turbo Boost Max Technology 3.0 | Y |
Intel® Speed Shift Technology | Y |
Component for | Server/workstation |
ECC | Y |
Memory channels | Hexa-channel |
Processor family | Intel® Xeon® Gold |
Processor manufacturer | Intel |
Processor model | 5217 |
Processor boost frequency | 3.7 GHz |
Processor cores | 8 |
Processor threads | 16 |
Processor cache | 11 MB |
Bus type | UPI |
PCI Express slots version | 3.0 |
Processor cache type | Smart Cache |
Processor codename | Cascade Lake |
Processor lithography | 14 nm |
Processor operating modes | 64-bit |
Processor package size | 76 x 56.5 mm |
Processor series | Intel Xeon Gold 5000 Series |
Processor socket | LGA 3647 (Socket P) |
Scalability | 4S |
Thermal Design Power (TDP) | 115 W |
On-board graphics card model | Not available |
Maximum internal memory supported by processor | 1000 GB |
Embedded options available | N |
Enhanced Intel SpeedStep Technology | Y |
Execute Disable Bit | Y |
Intel 64 | Y |
Intel Trusted Execution Technology | Y |
Intel TSX-NI | Y |
Intel Virtualization Technology (VT-x) | Y |
Intel VT-x with Extended Page Tables (EPT) | Y |
Intel® AES New Instructions (Intel® AES-NI) | Y |
Intel® Turbo Boost Technology | 2.0 |
Maximum number of PCI Express lanes | 48 |
Memory types supported by processor | DDR4-SDRAM |