| Maximum internal memory | 1000 GB |
| On-board graphics card | N |
| Discrete graphics card model | Not available |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Memory clock speeds supported by processor | 2933 MHz |
| Tcase | 87 °C |
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.1 GHz |
| Intel® vPro™ Platform Eligibility | Y |
| Discrete graphics card | N |
| Cooler included | N |
| Harmonized System (HS) code | 85423119 |
| Box | N |
| Market segment | Server |
| Status | Launched |
| Export Control Classification Number (ECCN) | 5A992C |
| Supported memory types | DDR4-SDRAM |
| Launch date | Q2'19 |
| PCI Express CEM revision | 3.0 |
| Intel® Transactional Synchronization Extensions | Y |
| Intel Turbo Boost Max Technology 3.0 | N |
| Intel® Speed Shift Technology | Y |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Number of UPI links | 3 |
| Intel® Volume Management Device (VMD) | Y |
| Intel® Run Sure Technology | Y |
| Mode-based Execute Control (MBE) | Y |
| Memory speed (max) | 2933 MHz |
| Intel® Optane™ DC Persistent Memory technology | Y |
| Intel® Deep Learning Boost (Intel® DL Boost) | Y |
| Intel® Resource Director Technology (Intel® RDT) | Y |
| Intel® Optane™ DC Persistent Memory Supported | Y |
| Intel Speed Select Technology (SST) | N |
| Package width | 1.69" |
| Package depth | 5.39" |
| Package height | 4.41" |
| Package weight | 7.09 oz |
| Package type | Retail box |
| Component for | Server/workstation |
| ECC | Y |
| Memory channels | Hexa-channel |
| Product type | Processor |
| Processor ARK ID | 192437 |
| Processor family | Intel® Xeon® Gold |
| Processor manufacturer | Intel |
| Processor model | 6230 |
| Processor boost frequency | 3.9 GHz |
| Processor cores | 20 |
| Processor threads | 40 |
| Processor cache | 27.5 MB |
| PCI Express slots version | 3.0 |
| Processor codename | Cascade Lake |
| Processor lithography | 14 nm |
| Processor operating modes | 64-bit |
| Processor package size | 76mm x 56.5mm mm |
| Processor socket | LGA 3647 (Socket P) |
| Scalability | 4S |
| Thermal Design Power (TDP) | 125 W |
| On-board graphics card model | Not available |
| Maximum internal memory supported by processor | 1024 GB |
| Embedded options available | Y |
| Enhanced Intel SpeedStep Technology | Y |
| Execute Disable Bit | Y |
| Intel 64 | Y |
| Intel Trusted Execution Technology | Y |
| Intel TSX-NI | Y |
| Intel Virtualization Technology (VT-x) | Y |
| Intel VT-x with Extended Page Tables (EPT) | Y |
| Intel® AES New Instructions (Intel® AES-NI) | Y |
| Intel® Turbo Boost Technology | 2.0 |
| Maximum number of PCI Express lanes | 48 |
| Memory types supported by processor | DDR4-SDRAM |