Products specifications

Attribute name	Attribute value
Bus clock rate	1600 MHz
Row active time	35 ns
Width	2.66"
Height	1.18"
Memory layout	1 x 8192 MB
Chips organization	X8
Lead plating	Gold
Memory bus	64 bit
Error indication	N
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Features
Module configuration	1G X 64
Internal memory	8192 MB
Internal memory type	DDR3L
Memory clock speed	1600 MHz
Component for	Notebook
Memory form factor	204-pin SO-DIMM
ECC	N
Buffered memory type	Unregistered (unbuffered)
CAS latency	11
Memory voltage	1.35,1.5 V
Memory layout (modules x size)	1 x 8 GB