Products specifications

Attribute name	Attribute value
Memory layout	1 x 4096 MB
Bus clock rate	1600 MHz
Error indication	ECC
Refresh row cycle time	160 ns
Row active time	35 ns
Width	5.25"
Height	1.18"
Chips organization	X8
Lead plating	Gold
Memory bus	72 bit
Row cycle time	48.125 ns
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Features
CAS latency	CL11
Module configuration	512M x 72
Internal memory	4096 MB
Internal memory type	DDR3
Memory clock speed	1600 MHz
Component for	PC/server
Memory form factor	240-pin DIMM
ECC	Y
Buffered memory type	Unregistered (unbuffered)
Memory voltage	1.35 V
Memory layout (modules x size)	1 x 4 GB